Level 4 Photorealistic 3D Modelling and Printing of custom Enclosures
Design custom enclosure with 3D modeling
Familiarize with 3D-Modelling software to build your own customized enclosure. You will get your own hero page on Solution Builder to present it. with your triple and 3D-printable case
This level not only enhances students' technical skills in 3D modelling and rendering, but also encourages creativity and innovation in designing custom enclosures for their rendered electronics. By mastering this level, students will be able to create professional-looking PCBs & enclosures that enhance the acceptance and aesthetics of their IoT devices.
Summary for this Level
Level 4 focuses on 3D modelling and the creation of custom enclosures for electronic projects. Students will use 3D modelling software like SketchUp to design and build their own 3D-printable enclosures, which can get showcased on a students hero page, if wanted. This level not only awakes students' technical skills in 3D modelling but also encourages creativity and innovation in designing custom solutions for their projects. By mastering these skills, students will be able to create professional-looking reditions of PCBs and enclosures that enhance the aesthetics, the acceptance and usability of their IoT devices.
| Level of Difficulty: advanced / AI related | Tutor: Warren |
Tutorial for this level
Motivational or Reference Video
Gained Tech Competences
Remembering: Level 4 challenges students to design custom enclosures using 3D modeling software such as TinkerCAD. Understanding: They will integrate the electronic device of their choice into their 3D-printed enclosure, virtually and in real, enhancing both the functionality and aesthetics of their device. Applying: Optionally, students will learn to automate smart home devices using Home Assistant. Analyzing: This level combines hardware design with software automation, providing a comprehensive skill set. Evaluating: Successful completion of this level earns students a 25% voucher for ChipGlobe.shop, for evaluating results in real, e.g. by 3D-printing their 3D-model.
Gained Soft Skills
Remembering: Level 4 emphasizes creativity and problem-solving as students design custom enclosures using 3D modeling software. Understanding: They will improve their communication skills by sharing their design and explaining their choices. Applying: Time management is crucial for balancing design and integration tasks. Analyzing: Adaptability is required to learn new software tools, and attention to detail ensures high-quality snug-fit designs. Evaluating: Resilience is built as they iterate on their designs to achieve the desired outcome.
Summary for this Level
Level 4 focuses on 3D modelling and the creation of custom enclosures for electronic projects. Students will use 3D modelling software like SketchUp to design and build their own 3D-printable enclosures, which can get showcased on a students hero page, if wanted. This level not only awakes students' technical skills in 3D modelling but also encourages creativity and innovation in designing custom solutions for their projects. By mastering these skills, students will be able to create professional-looking reditions of PCBs and enclosures that enhance the aesthetics, the acceptance and usability of their IoT devices.
